Micron Technology is investing US$7 billion to establish a cutting-edge semiconductor packaging plant in Woodlands, Singapore. Scheduled to open in 20
Micron Technology is investing US$7 billion to establish a cutting-edge semiconductor packaging plant in Woodlands, Singapore. Scheduled to open in 2026, the facility will specialise in high-bandwidth memory (HBM) chips, which are essential for AI accelerators and data centres requiring high-speed and energy-efficient solutions.
The HBM market is poised for explosive growth, with demand expected to surge from US$4 billion in 2023 to over US$100 billion by 2030, according to Micron CEO Sanjay Mehrotra. These advanced chips, designed to stack memory for enhanced performance, are vital to supporting the expanding AI landscape.
Singapore, already responsible for 10% of global chip production and 20% of semiconductor equipment, continues to attract significant investments in high-tech manufacturing. Micron’s project will create 1,400 jobs initially, expanding to 3,000 as operations scale.
Sustainability at the Core
Micron’s facility will incorporate green technologies, including greenhouse gas abatement and water recycling systems, aiming for LEED certification. Automation powered by AI will optimise processes, reducing waste and energy consumption.
This sustainable approach aligns with Micron’s broader vision of supporting advanced applications like AI, gaming, and augmented reality while minimising environmental impact.
A Strategic Milestone
The opening of this plant in 2026 will further solidify Singapore’s role as a key player in the global AI and semiconductor ecosystem, bolstering its reputation as a hub for technological innovation and sustainable development.
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